Hong Kong Science and Technology Parks Corporation (HKSTP) and the Efficiency Office last week brought 40 park companies to showcase their I&T solutions to more than 300 senior government officials from over 50 HKSAR government bureaus and departments, as part of the first-ever Innovation and Technology Trade Show 2019 S/S.
The Innovation and Technology Trade Show 2019 S/S was held in conjunction with the Government’s pro-innovation procurement policy coming into effect in April 2019. The event’s goal is to help government bureaus and departments increase their awareness of the availability of home-grown I&T solutions that can solve their operational issues, while promoting the participation of start-ups and SMEs in government procurement programs. Throughout the day, there were discussion panels and sharing sessions on ways to adopt new I&T solutions, and pitching sessions by I&T start-ups on their solutions for efficiency enhancement. Tours were also given to attendees to observe HKSTP’s Smart Campus solutions at work.
Albert Wong, CEO of HKSTP, said, “Hong Kong Science Park is the designated living lab and testbed for our city’s Smart City innovations. We hope that by observing the solutions in action, the respective government agencies will be able to see their practical benefits and accelerate the implementations in our city. We also hope that the government’s lead to embrace digital transformation will inspire more Hong Kong businesses to explore I&T solutions. It’s a win-win arrangement for all – we will become more efficient, while creating more opportunities for our I&T start-ups and talent.”
The Technologies from Science Park program provides a platform to help companies to adopt I&T solutions from park companies. More than 320 business matchings were held over the last 4 years. 65 organizations in Hong Kong, such as Hong Kong Airport Authority (HKIA), MTR, Maxim’s Group, HSBC, Wheelock and 3HK were involved in the program, with a total of 66 successful implementations of I&T solutions from park companies.